Head of Hardware Group

2 weeks ago

Raanana, Central District, Israel D-Fend Solutions Full time

Job Description

We are seeking an experienced and visionary Head of Hardware Group to lead a multi-disciplinary hardware team (Digital, Mechanical, and RF). The role requires a strong technical background, proven leadership skills, and the ability to drive innovative, high-quality hardware solutions from concept to production. This position combines hands-on involvement with strategic management, ensuring the successful delivery of complex products in dynamic and demanding environments.

Principle Duties and Responsibilities:
  • Lead and manage a multi-disciplinary hardware group (Digital, Mechanical, and RF), including recruitment, mentoring, performance evaluation, and career development.
  • Define group strategy, methodologies, and KPIs to align with company goals.
  • Provide technical leadership in system architecture, design reviews, and troubleshooting complex challenges across domains.
  • Oversee the end-to-end product lifecycle: concept definition, system architecture, schematic design, PCB layout, mechanical design, integration, validation, and transition to production.
  • Drive innovation and adoption of new technologies, tools, and design methodologies.
  • Manage schedules, resources, and priorities to ensure timely delivery and budget compliance.
  • Build strong collaboration with FPGA, software, system engineering, validation, and operations teams.
  • Ensure compliance with product certifications and regulatory standards (CE, FCC, Mil-461, etc.).
  • Represent the HW group in executive management forums and in front of customers, partners, and subcontractors.
  • Establish a culture of ownership, accountability, and continuous improvement within the group.
Knowledge, Skills and Experience Required:
  • BSc in Electrical Engineering from a leading university – MUST (MSc or higher – Advantage).
  • 10+ years of hardware engineering experience in multi-disciplinary environments – MUST.
  • 5+ years of experience in managing hardware teams, including direct management of Digital, Mechanical, and RF engineers – MUST.
  • Proven track record in high-speed digital design, schematic/PCB layout, and integration of complex systems.
  • Hands-on familiarity with mechanical design processes and working with subcontracted manufacturing.
  • Experience in RF design and integration – Advantage.
  • Strong background in SI/PI analysis, power distribution, and EMI/EMC considerations.
  • Experience in DFx methodologies (Design for Manufacturability, Testability, Reliability).
  • Knowledge in defense/military applications – Advantage.
  • Familiarity with certification and compliance processes (CE, FCC, Mil-461, etc.).
  • Strong project management skills: planning, prioritization, resource allocation, risk management.
  • Excellent interpersonal and communication skills, with the ability to inspire and motivate a diverse team.
  • Entrepreneurial mindset with system-level thinking and problem-solving orientation.
  • Fluent English (spoken and written).
Personal Attributes:
  • Natural leader with high emotional intelligence and the ability to manage across disciplines.
  • Strategic thinker with hands-on execution abilities.
  • Strong decision-making skills, especially under uncertainty or tight schedules.
  • Ability to balance innovation with pragmatism in delivering working solutions.
  • High accountability, ownership, and drive for excellence.

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