Product Engineer – Semiconductor Products

22 hours ago

Netanya Center District, Israel Ethosia Full time ₪90,000 - ₪120,000 per year

Operations & Lifecycle Management

  • Own all product engineering activities with subcontractors (sub-cons), from product definition until end-of-life, through bring-up, characterization,
  • qualification and mass production.
  • Act as the main technical interface between design, operations, and suppliers.
  • Drive continuous improvement in cost, yield, and quality throughout the product lifecycle.

Core Product Engineering Areas

  • Package Design: Define, review, and validate semiconductor package designs to meet electrical, thermal, and mechanical requirements.
  • Test Development (Probe & Final Test): Lead development and deployment of probe and final test solutions, ensuring robust test coverage and
  • efficiency.
  • Qualification: Manage device and package qualification to meet reliability standards (JEDEC, automotive, or customer-specific).
  • Characterization: Drive device characterization for performance validation across PVT (Process, Voltage, Temperature) conditions.
  • Yield Enhancement: Monitor, analyze, and improve manufacturing/test yields in collaboration with foundries and OSATs.

System-Level Support

  • Support PCIe board qualification activities (in collaboration with the systems engineering team).
  • Provide technical expertise for system-level bring-up, debug, and customer support when required.

Cross-Functional & Supplier Engagement

  • Work closely with design engineering, quality, operations, and product management teams.
  • Collaborate with subcontractors, test houses, and packaging vendors to ensure smooth production ramp-up and scalability.
  • Manage engineering change orders (ECOs) and ensure traceability across production.

Basic Requirements

  • Bachelor's or Master's degree in Electrical Engineering, Physics, Materials Science, or related field.
  • 10+ years of experience in semiconductor product engineering, test engineering, or packaging development.
  • Strong knowledge of semiconductor and IC manufacturing processes.
  • Proficiency in data analysis and yield enhancement tools
  • Experience working with foundries, OSATs, and subcontractors.
  • Excellent problem-solving, communication, and project management skills.

Preferred Qualifications

  • Knowledge of PCIe, high-speed interfaces, or board-level qualification.
  • Experience with Pacakge design and ATE development and debug.
  • Familiarity with failure analysis tools and reliability methodologies.
  • Background in high-volume manufacturing (HVM) and yield improvement projects.
  • Understanding of statistical process control (SPC) and design of experiments (DOE).

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