Hardware Team Lead

5 hours ago

Petah Tikva Center District Israel Newphotonics Full time ₪120,000 - ₪180,000 per year

About the Job

Our Hardware group leads the development of electro-optical devices and systems for next-generation data centers.

NewPhotonics is revolutionizing data center processing with novel photonic engines that address power and performance challenges.

We are looking for a Hardware Team Lead to join our dynamic team and play a key role in shaping the technological landscape of our organization.

What You'll Be Doing:

  • Actively participate in hands on PCB design including schematics creation and layout work using industry standard EDA tools.
  • Participate in the research and development of next-generation electro-optical (EO) devices and sub-systems for high-speed communication.
  • Define electrical specifications for EO sub-systems and evaluation boards, including schematic design, component selection, characterization, layout
  • considerations, and implementation. Provide guidance on fabrication and assembly.
  • Work with advanced PCB technologies such as MLO, mSAP and SLP
  • Develop high-speed designs supporting speeds up to 224 Gbps.
  • Lead board bring-up, characterization, and debug, including high-speed scope and VNA measurements.
  • Collaborate with hardware project teams, including Board Design, Mechanics, Thermal, PCB Layout, Production, Software/Firmware, Photonics, and more.
  • Utilize state-of-the-art laboratory equipment.

What We're Looking For:

  • B.Sc. in Electrical Engineering.
  • Experience in design ownership on major blocks/clusters from definition through implementation phases.
  • 10+ years as a board designer with experience in executing complex hardware projects.
  • Proven experience in leading multi-disciplinary projects.
  • Hands-on experience with Cadence tools (Allegro, OrCAD) for schematic capture and PCB layout.
  • Strong hands-on lab skills.
  • Experience with advanced PCB materials and technologies (MLO, mSAP, SLP, HDI).
  • Understanding of ASIC design flow, substrate design, and packaging.
  • Experience in designing products for high-volume manufacturing.
  • Strong project management skills, independence, and excellent interpersonal abilities.
  • Proven proficiency in ANSYS HFSS / SIwave / 3D Layout for electromagnetic, SI, and PI simulations.
  • Strong understanding of transmission lines, impedance control, crosstalk, and return-path design.
  • Ability to interpret and simulate S-parameters, eye diagrams, and frequency-domain models.
  • Familiarity with lab equipment such as oscilloscopes, VNAs, and spectrum analyzers.

What Will Make You a Star Candidate:

  • Experience with optical transceivers.
  • Familiarity with optical or photonic integration (CPO/LPO) environments.
  • Experience in lab automation using Python-based tools.
  • Familiarity with IEEE standards.
  • Knowledge of photonic integration technology and its ecosystem.

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