Product Engineer
2 weeks ago
Overview
We are looking for a
Product Engineer
to lead and manage the full lifecycle of
Speedata's APU (Analytics Processing Unit)
— from design through volume production to end-of-life. This role will be responsible for interfacing with subcontractors, driving engineering execution, and ensuring that our APU products meet stringent performance, reliability, and cost targets. The ideal candidate combines deep technical expertise in semiconductor product engineering with strong program management and cross-functional collaboration skills. This position reports directly to the
VP of Operations
and works closely with design, systems engineering, and quality teams.
Key Responsibilities
Operations & Lifecycle Management
- Own all product engineering activities with subcontractors (sub-cons), covering design, qualification, mass production, and end-of-life processes.
- Act as the main technical interface between design, operations, and suppliers.
- Drive continuous improvement in cost, yield, and quality throughout the product lifecycle.
Core Product Engineering Areas
- Package Design:
Define, review, and validate semiconductor package designs to meet electrical, thermal, and mechanical requirements. - Test Development (Probe & Final Test):
Lead development and deployment of probe and final test solutions, ensuring robust test coverage and efficiency. - Qualification:
Manage device and package qualification to meet reliability standards (JEDEC, automotive, or customer-specific). - Characterization:
Drive device characterization for performance validation across PVT (Process, Voltage, Temperature) conditions. - Yield Enhancement:
Monitor, analyze, and improve manufacturing/test yields in collaboration with foundries and OSATs.
System-Level Support
- Support
PCIe board qualification
activities (in collaboration with the systems engineering team). - Provide technical expertise for system-level bring-up, debug, and customer support when required.
Cross-Functional & Supplier Engagement
- Work closely with design engineering, quality, operations, and product management teams.
- Collaborate with subcontractors, test houses, and packaging vendors to ensure smooth production ramp-up and scalability.
- Manage engineering change orders (ECOs) and ensure traceability across production.
Basic Requirements
- Bachelor's or master's degree in
electrical engineering. - 10+ years of experience
in semiconductor product engineering, test engineering, or packaging development. - Hands-on experience with
package design, test program development, and product qualification
. - Strong knowledge of
semiconductor device physics and IC manufacturing processes
. - Proficiency in
data analysis
(e.g., Python, MATLAB, JMP, or similar tools). - Experience working with
foundries, OSATs, and subcontractors
. - Excellent problem-solving, communication, and project management skills.
Preferred Qualifications
- Knowledge of
PCIe, high-speed interfaces, or board-level qualification
. - Experience with
ATE development and debug
. - Familiarity with
failure analysis tools and reliability methodologies
. - Background in
high-volume manufacturing (HVM) and yield improvement projects
. - Understanding of
statistical process control (SPC) and design of experiments (DOE)
.
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